Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.
Light-cure conformal coatings cure tack-free in seconds upon exposure to UV/Visible or LED light and feature secondary heat or moisture-cure capability for shadow areas on PCBs. They protect printed circuit boards and components from extreme environmental conditions such as heat, chemicals, and humidity.
Non-medical-grade electronic adhesives and encapsulants for consumer wearable device assembly cure quickly with light and are designed for applications where skin proximity and sensitivity are a concern. The 9200-W product series is formulated with low sensitizing ingredients, with certain skin irritants such as isobornyl acrylate (IBOA) removed. The materials feature good bonding ability, flexibility, and weatherability and are made for lens alignment, structural bonding, encapsulation of components found in AR/VR headsets, earbuds, and other wearable devices.
UV/Visible light-curable dome and decorative coatings form clear, non-yellowing, low-profile domes on PVC and polycarbonate nametags. These one-component materials require no mixing, are suitable for rigid and flexible substrates as well as indoor and some outdoor applications. Bondable substrates include CAP, PC, and PVC.
Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.
Electronic edgebond adhesives cure with UV/Visible light in seconds for rapid ruggedizing of components and circuitry on printed circuit boards where shock attenuation is needed. The materials bond to silicon, ceramic, lead frame, and PCB making them suitable for reinforcement of fine-pitch leads or leadless components and a good alternative to underfill.
No solvents added LED encapsulants cure rapidly upon UV/Visible light exposure for instant casting of LEDs, LED die attach, and room-temperature coating of LED arrays. The materials feature a high 12,000 cP (nominal) viscosity for domes and is designed for applications where the continuous operating temperature is below 100ºC [212ºF] and production speeds are critical.
Multi-Cure® potting adhesives cure rapidly upon UV/Visible light exposure and feature a secondary heat-cure or activator-cure function for shadow areas on PCBs. These potting compounds exhibit translucent bonds and provide excellent adhesion to engineered plastics for connector, thermal switch, and sensor potting, and can be utilized for tamper proofing applications. Bondable substrates include many types of phenolic, thermoset, and filled plastics as well as ceramic, glass, and metal.
Multi-Cure® thermal interface adhesives cure in seconds with UV light, heat, and/or activator and are designed for electronics applications where highly conductive bonds to heat-dissipation components on PCBs are critical. The materials can rapidly mount heat-sensitive components to printed circuit boards and bond well to FR4, ceramic, lead frame, PCB, and silicon substrates.
Multi-Cure® electronic wire tacking adhesives, for PCB repair wires, bond to a wide variety of printed circuit substrates and wire jackets. On-demand UV/Visible light cure for precise material placement results in faster fixture time, increased throughput, and less WIP. Products feature heat-cure capability for applications with shadow areas.
Gasket adhesive sealants form in place on complex surfaces and channel configurations, and then cure in place upon exposure to UV/Visible or LED light exposure. They act as a barrier to protect surfaces from dust, noise, and other destructive elements and replace labor-intensive tape, die-cut gaskets, and other sealant technologies.
Industrial glass bonding adhesives cure rapidly with UV/Visible light, heat, or activator to form high-strength bonds to various substrates including soft, borosilicate, UV-blocked, and tinted glass. They even bond to lead crystal, steel, plated metals, and thermoset plastics. These optically clear glass bonders exhibit good thermal cycling performance and are suitable for architectural, figurine, furniture, stemware, and novelty assembly.
Dymax® HLC™ (Hybrid Light-Curable) technology combines the best qualities of anionic and free radical chemistries. The HLC™ adhesive line is capable of curing in light and darkness with either UV/Visible light or a combination of UV/Visible light and contact/moisture. Primary features include fast cure, low-to-no blooming after proper light cure, humidity resistance, more flexible joints than ordinary CAs, and better aesthetics. Substrates are not required to be translucent, and light curing exposure increases the integrity of the bonds.
MD® catheter adhesives cure with UV/Visible or LED light in seconds to quickly bond common substrates such as ABS, PA, glass, PC, stainless steel, nitinol, aluminum, polyurethane used in catheter assembly. These adhesive meet or exceed ISO 10993 standards and are compatible with EtO, E-Beam, and gamma sterilization. Applications include balloon bonding, marker bands, and Y-connectors. Formulations are available with See-Cure, Ultra-Red®, or Encompass® technology for easy verification of adhesive placement, cure, and inspection.
UV/LED light-curable adhesives bond glass and other difficult substrates such as COC/COP thermoplastics used for in-vitro diagnostics applications. Rapid assembly of microplates, lab-on-chip devices, and silicon wafers used in blood and tissue testing is possible with fast light curing, one-component formulations that require no mixing. Products with Dymax® Ecnompass® or patented See-Cure and Ultra-Red® fluorescing technologies are available.
Multipurpose medical device adhesives are designed to rapidly bond medical-grade plastics upon exposure to UV/Visible light. The products meet ISO approvals and bond well to many different substrates including tinted and UV-inhibited plastics. Some formulations feature patented Encompass® technology which enables easy visual confirmation of adhesive placement and cure and fluorescence for post-cure quality inspection.
Needle bonding adhesives cure in seconds when exposed to UV/Visible/LED light for high-speed, high-volume syringe assembly lines that incorporate inline testing and packaging. Medica- grade products feature red or blue fluorescing for quality inspection under automated sensing or vision systems. Bondable substrates include PC, PMMA, and PA plastics as well as glass and metal.
MD® medical respiratory device adhesives cure with UV/LED/Visible light for fast assembly of breathing circuits, anesthesia masks, resuscitator bags, and other airway management apparatus. The adhesives form flexible, strong, moisture resistant bonds to PET, SEBs, ABS, PS, and PVC substrates.
Adhesives for medical wearable device assembly are formulated without IBOA (isobornyl acrylate), a known skin irritant and TPO, a material of concern. The 2000-MW series of products cures with UV/LED light to seal, encapsulate, coat, and bond components in medical wearables such as drug delivery devices. The materials pass ISO 10993-10 / -23 for sensitization and irritation and ISO 10993-5 for cytotoxicity and bond to PC, PVC, SS, PI, TPU and other difficult-to-bond-to substrates.
Multi-Cure® industrial metal bonding adhesives form high-strength bonds to metal and magnets using UV/Visible light, heat (for shadow areas), or pre-applied activator (for opaque substrates). These metal bonders also adhere well to filled nylon, phenolic plastics, polyamide, and dissimilar substrates. Applications include magnet and metal bonding, DC motor assembly, shallow potting, and coil winding.
Optical adhesives provide low-stress, low-movement, and gap filling to 1/4 inch for lens bonding, laminating, and positioning, VCSEL potting, optical mounting, and fiber optic assembly applications. One-part optical epoxies cure in seconds to UV/Visible light and bond well to glass, metal, ceramic, quartz, and plastic substrates. High-tensile-strength, optically clear bonds of 3,000 psi, and shrinkage as low as 0.1% are possible.
Optical display adhesives cure rapidly upon UV/Visible light exposure for bonding and laminating small-to-large touch screens. Their non-yellowing low shrinkage characteristics, reworkability, and adhesion to PET and glass substrates make them good candidates for panel display assembly where these attributes are critical.
Industrial plastic bonding adhesives cure in seconds upon UV/Visible or LED light exposure. These no solvents added, one-component plastic bonders require no mixing and quickly form strong bonds, enabling high-speed production and increased throughput. They adhere to a broad range of substrates including PC, phenolic, acrylic, liquid crystal polymer, and PVC, as well as UV-blocked plastics. Typical applications include display, light fixture, housing and appliance assembly, vibration dampening, and protective sealing of critical components.
SpeedMask® maskants are designed to protect metal components and PCBs prior to surface finishing, conformal coating, or wave solder and reflow processes. They are applied in one layer and cure in seconds "on-demand" when exposed to UV/Visible light. After proper cure, the maskants easily peel off leaving no silicone, ionic contamination, or corrosive residues behind.
Activators are pre-applied to metal, glass, ceramic, and thermoset substrates to increase the bond strength of specific Dymax® structural adhesives in shadow areas. They are used between opaque, close-fitting parts to form durable bonds up to 3,500 psi in 10-30 seconds. Applications include magnet and ferrite bonding, motor assembly, and metal joining.
Dymax® BlueWave® broad-spectrum and LED spot-lamp curing systems deliver high intensity UV/Visible light to precise locations on assembled components in 1 to 10 seconds. Units can be operated manually or integrated into high-speed automated assembly lines. Conventional lamps emit from 300-450 nm of energy in the UVA and visible portion of the light spectrum, while LED units provide narrow bands of energy in the 365, 385, or 405 nm wavelength range.
Dymax® broad-spectrum and LED flood-lamp curing systems deliver moderate- to high-intensity LED/UV/Visible light to cure larger parts or trays of multiple parts in 5-30 seconds. The units offer consistent line speed, lamp height, and intensity and are ideal for light-curing of adhesives, coatings, and UV inks. Systems can function as stand-alone curing systems or can be integrated into automated assembly lines.
Dymax® UV curing conveyor systems provide reliable, consistent, safe curing of UV/Visible and LED-curable adhesives, coatings, and UV inks. The units utilize curing lamps, with metal halide (longwave) or mercury (shortwave) bulbs or LED arrays, that are mounted above or on the sides of the conveyor for flexible curing options and to accommodate a variety of applications.
Maintaining consistent light intensity in a curing process requires the use of a UV radiometer to provide accurate measuring and monitoring of the UV-A, LED, and visible light emitted by curing systems. Dymax® radiometers provide quality assurance that light-curing equipment remains within the required curing parameters and are available for flood lamps, conveyors, and spot lamps.
An array of accessories is available to enhance and improve the overall effectiveness of Dymax® light curing equipment. From lightguides and shutters to mounting stands and replacement bulbs, users can design the curing system required for their manufacturing process.
Dymax® manual and automated fluid dispensing systems provide consistent dispense of low- to high-viscosity materials and eliminate common issues such as inaccurate flow, stringing, and product contamination. Items include spray valves, dispense valves, controllers, and syringe dispensers that can be integrated into new or existing manufacturing processes.
Dymax® has a variety of accessories to enhance the design and function of dispensing systems including controllers, level-sensing reservoirs, ram pumps, and air pressure regulators.
