Electronic edgebond adhesives cure with UV/Visible light in seconds for rapid ruggedizing of components and circuitry on printed circuit boards where shock attenuation is needed. The materials bond to silicon, ceramic, lead frame, and PCB making them suitable for reinforcement of fine-pitch leads or leadless components and a good alternative to underfill.

• UV/Visible/LED Light Cure
• No solvents added
• Electrically insulating
• Low stress under thermal cycling
• Low VOCs and high coverage
• Secondary heat or moisture-cure formulations available
• Minimize handling and increase throughput with fast curing
• Simple dispense eliminates costs of complex dispensing system maintenance