Camera Module Adhesives On Dymax Corp.

Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

Low CTE and High Tg
Very low volumetric shrinkage
Cure with UV/Visible or LED light and/or heat cure
Moisture- and thermal-cycle resistant
Low ASTM E595 Outgassing
Low temperature heat cure (80-85ºC)
Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)

Item #	Item Name	Brands	Nominal Viscosity	Uncured Appearance	Volumetric Shrinkage
9801	N/A 60,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive	N/A Dymax®	N/A 60,000 cP	N/A Off White Opaque to Charcoal Translucent Gel	N/A 1.5 %
9803	N/A 86,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive	N/A Dymax®	N/A 86,000 cP	N/A Off White Opaque to Charcoal Translucent Gel	N/A 1.1 %