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Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

  • Low CTE and High Tg
  • Very low volumetric shrinkage
  • Cure with UV/Visible or LED light and/or heat cure
  • Moisture- and thermal-cycle resistant
  • Low ASTM E595 Outgassing
  • Low temperature heat cure (80-85ºC)
  • Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)
Camera Module Adhesives
Unit of Measure
1 

Item #

Item Name

Brands

Nominal Viscosity

Uncured Appearance

Volumetric Shrinkage

9801 N/A 60,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive N/A Dymax® N/A 60,000 cP N/A Off White Opaque to Charcoal Translucent Gel N/A 1.5 %
9803 N/A 86,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive N/A Dymax® N/A 86,000 cP N/A Off White Opaque to Charcoal Translucent Gel N/A 1.1 %
Unit of Measure
1