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Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

  • Low CTE and High Tg
  • Very low volumetric shrinkage
  • Cure with UV/Visible or LED light and/or heat cure
  • Moisture- and thermal-cycle resistant
  • Low ASTM E595 Outgassing
  • Low temperature heat cure (80-85ºC)
  • Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity

 N/A 86,000 cP

Uncured Appearance

 N/A Off White Opaque to Charcoal Translucent Gel

Volumetric Shrinkage

 N/A 1.1 %

Recommended Substrates

 N/A Acrylonitrile-Butadiene-Styrene (ABS) Aluminum Cellulose Acetate Propionate (CAP) Flame Retardant (FR-4) Board Glass Liquid Crystal Polymer (LCP) Magnesium Polycarbonate (PC) Polyethylene Terephthalate (PET) Polyphenylene Sulfide (PPS) Polystyrene (PS) Stainless Steel (SS)

Industry Standards

 N/A American Society for Testing and Materials (ASTM) E595

Features

Features

 N/A
  • Rapid LED or UV/Visible light and/or heat cure
  • Very low volumetric shrinkage
  • High Tg and Low CTE
  • Low ASTM E595 Outgassing
  • No frozen storage, refrigerated shipment/storage 1-5 ºC [34-41 ºF]

Additional Information

Additional Information

 N/A Low Shrinkage Optical Camera Module Adhesive with LED and/or Heat-Cure

Dymax® 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well as low temperature heat for shadow areas.

In addition, 9803 meets critical low-outgassing specifications making it ideal for complex optical positioning applications such as lens bonding, bonding the lens barrel to holder or bonding the holder to printed circuit boards (PCBs).

The one component epoxy requires cold shipment and cold storage (and should be kept between 1 ºC (34 ºF) and 5 ºC (41 ºF) but does not require frozen shipment or storage conditions. The epoxy has improved 85 ºC/85% RH resistance, exhibits less overall movement through thermal excursions and features higher viscosity and thixotropy to maintain bead shape upon dispense.