COMPANY HEADER
Request Information
Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

  • Low CTE and High Tg
  • Very low volumetric shrinkage
  • Cure with UV/Visible or LED light and/or heat cure
  • Moisture- and thermal-cycle resistant
  • Low ASTM E595 Outgassing
  • Low temperature heat cure (80-85ºC)
  • Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity

 N/A 60,000 cP

Uncured Appearance

 N/A Off White Opaque to Charcoal Translucent Gel

Volumetric Shrinkage

 N/A 1.5 %

Recommended Surfaces

 N/A Flexible Printed Circuit (FPC) Liquid Crystal Polymer (LCP) Polyphenylene Sulfide (PPS) Printed Circuit Boards (PCB)

Recommended Substrates

 N/A Cellulose Acetate Propionate (CAP) Flame Retardant (FR-4) Glass Polystyrene (PS)

Industry Standards

 N/A American Society for Testing and Materials (ASTM) E595

Features

Features

 N/A
  • Fast cure with LED or UV/Visible light
  • Low temperature heat cure (80-85ºC)
  • Moisture resistant
  • Thermal cycle resistant
  • Single component
  • Cold ship/Cold storage at 1-5ºC
  • Passes ASTM E595 Outgassing Testing

Additional Information

Additional Information

 N/A Low Shrinkage Camera Module Adhesive with LED and Heat-Cure Capability

Dymax® 9801 is a LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle resistant and meets the stringent low-shrinkage requirements introduced for active alignment applications in Advanced Driver Assistance Systems (ADAS). 9801 cures with UV light but also features heat-cure capability for applications where shadowed areas exist. This one-component product bonds rapidly and is recommended for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass.

9801 requires cold storage/cold shipping and should be kept between 1ºC (34ºF) and 5ºC (41ºF) in the original, unopened container.

Dymax® materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.