COMPANY HEADER
Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

  • Low CTE and High Tg
  • Very low volumetric shrinkage
  • Cure with UV/Visible or LED light and/or heat cure
  • Moisture- and thermal-cycle resistant
  • Low ASTM E595 Outgassing
  • Low temperature heat cure (80-85ºC)
  • Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)
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60,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive

60,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive
86,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive

86,000 Centipoise (cP) Nominal Viscosity Camera Module Adhesive
Description N/A Camera module adhesives cure rapidly with UV/Visible or LED light and feature secondary heat-cure capability for shadow-areas. Low shrinkage, moisture- and thermal-cycle resistant epoxies are well suited for various active alignment, optical bonding, and other camera module applications associated with ADAS and LiDAR assembly. Bondable substrates include PPS, FR-4, LCP, PCB, PPS, CAP, PS, and glass. The materials meet Low ASTM E595 Outgassing.

  • Low CTE and High Tg
  • Very low volumetric shrinkage
  • Cure with UV/Visible or LED light and/or heat cure
  • Moisture- and thermal-cycle resistant
  • Low ASTM E595 Outgassing
  • Low temperature heat cure (80-85ºC)
  • Cold shipment and cold storage (between 1ºC (34ºF) and 5ºC (41ºF)
Brands N/A Dymax®
Nominal Viscosity N/A 60,000 cP N/A 86,000 cP
Uncured Appearance N/A Off White Opaque to Charcoal Translucent Gel
Volumetric Shrinkage N/A 1.5 % N/A 1.1 %
Recommended Surfaces N/A Flexible Printed Circuit (FPC) Liquid Crystal Polymer (LCP) Polyphenylene Sulfide (PPS) Printed Circuit Boards (PCB) N/A
Recommended Substrates N/A Cellulose Acetate Propionate (CAP) Flame Retardant (FR-4) Glass Polystyrene (PS) N/A Acrylonitrile-Butadiene-Styrene (ABS) Aluminum Cellulose Acetate Propionate (CAP) Flame Retardant (FR-4) Board Glass Liquid Crystal Polymer (LCP) Magnesium Polycarbonate (PC) Polyethylene Terephthalate (PET) Polyphenylene Sulfide (PPS) Polystyrene (PS) Stainless Steel (SS)
Industry Standards N/A American Society for Testing and Materials (ASTM) E595
Features N/A
  • Fast cure with LED or UV/Visible light
  • Low temperature heat cure (80-85ºC)
  • Moisture resistant
  • Thermal cycle resistant
  • Single component
  • Cold ship/Cold storage at 1-5ºC
  • Passes ASTM E595 Outgassing Testing
 		N/A
  • Rapid LED or UV/Visible light and/or heat cure
  • Very low volumetric shrinkage
  • High Tg and Low CTE
  • Low ASTM E595 Outgassing
  • No frozen storage, refrigerated shipment/storage 1-5 ºC [34-41 ºF]
Additional Information N/A Low Shrinkage Camera Module Adhesive with LED and Heat-Cure Capability

Dymax® 9801 is a LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle resistant and meets the stringent low-shrinkage requirements introduced for active alignment applications in Advanced Driver Assistance Systems (ADAS). 9801 cures with UV light but also features heat-cure capability for applications where shadowed areas exist. This one-component product bonds rapidly and is recommended for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass.

9801 requires cold storage/cold shipping and should be kept between 1ºC (34ºF) and 5ºC (41ºF) in the original, unopened container.

Dymax® materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. 		N/A Low Shrinkage Optical Camera Module Adhesive with LED and/or Heat-Cure

Dymax® 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well as low temperature heat for shadow areas.

In addition, 9803 meets critical low-outgassing specifications making it ideal for complex optical positioning applications such as lens bonding, bonding the lens barrel to holder or bonding the holder to printed circuit boards (PCBs).

The one component epoxy requires cold shipment and cold storage (and should be kept between 1 ºC (34 ºF) and 5 ºC (41 ºF) but does not require frozen shipment or storage conditions. The epoxy has improved 85 ºC/85% RH resistance, exhibits less overall movement through thermal excursions and features higher viscosity and thixotropy to maintain bead shape upon dispense.