COMPANY HEADER
  • Electronic Encapsulants
Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
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Item #

Item Name

Nominal Viscosity

Durometer Hardness

Elongation at Break

Modulus of Elasticity

N/A 45 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant N/A 4,500 cP N/A A85 N/A 300 % N/A 45 MPa6,500 psi
N/A 17.5 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant N/A 7,000 cP N/A D30-D50 N/A 38 % N/A 17.5 MPa2,550 psi
N/A 18.4 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant N/A 17,000 cP N/A D30-D50 N/A 34 % N/A 18.4 MPa2,670 psi
N/A 17.6 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant N/A 25,000 cP N/A D30-D50 N/A 36 % N/A 17.6 MPa2,560 psi
N/A 4,500 Centipoise (cP) Nominal Viscosity Electronic Encapsulant N/A 4,500 cP N/A D45 N/A N/A
N/A 6.2 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant N/A 55,000 cP N/A D40 N/A 110 % N/A 6.2 MPa900 psi
N/A 18,000 Centipoise (cP) Nominal Viscosity Electronic Encapsulant N/A 18,000 cP N/A N/A N/A
N/A 400 Centipoise (cP) Nominal Viscosity Electronic Encapsulant N/A 400 cP N/A N/A N/A
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