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Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
Unit of Measure

Specifications

Brands

 N/A Dymax®

Halogen Free?

 N/A Yes

Uncured Properties

Nominal Viscosity

 N/A 25,000 cP

Cured Mechanical Properties

Durometer Hardness

 N/A D30-D50

Elongation at Break

 N/A 36 %

Modulus of Elasticity

 N/A 17.6 MPa2,560 psi

Applications

N/A

  • Chip-on-board
  • Chip-on-flex
  • Chip-on-glass
  • Wire bonding

Additional Key Features

N/A

  • 100% no solvents added
  • Low stress under thermal cycling
  • Instant UV/Visible cures
  • Electrically insulating
  • High ionic purity
  • Room-temperature storage
  • Tenacious adhesion to flex circuit substrates (polyimide and PET)
  • Thermal shock and moisture resistance