Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.
- UV/Visible/LED Light Cure
- Electrically insulating
- Low stress under thermal cycling
- Secondary heat or moisture-cure formulations available
- Minimize handling and increase throughput with fast curing
- Simple dispense eliminates costs of complex dispensing system maintenance
Unit of Measure
1
Item # |
Item Name |
Nominal Viscosity |
Durometer Hardness |
Elongation at Break |
Modulus of Elasticity |
|---|---|---|---|---|---|
| 9008 | N/A 45 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant | N/A 4,500 cP | N/A A85 | N/A 300 % | N/A 45 MPa6,500 psi |
| 9101 | N/A 17.5 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant | N/A 7,000 cP | N/A D30-D50 | N/A 38 % | N/A 17.5 MPa2,550 psi |
| 9102 | N/A 18.4 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant | N/A 17,000 cP | N/A D30-D50 | N/A 34 % | N/A 18.4 MPa2,670 psi |
| 9103 | N/A 17.6 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant | N/A 25,000 cP | N/A D30-D50 | N/A 36 % | N/A 17.6 MPa2,560 psi |
| 9001-E V3.1 | N/A 4,500 Centipoise (cP) Nominal Viscosity Electronic Encapsulant | N/A 4,500 cP | N/A D45 | N/A | N/A |
| 9037-F | N/A 6.2 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant | N/A 55,000 cP | N/A D40 | N/A 110 % | N/A 6.2 MPa900 psi |
| 9014 | N/A 18,000 Centipoise (cP) Nominal Viscosity Electronic Encapsulant | N/A 18,000 cP | N/A | N/A | N/A |
| 9001-E-V3.0 | N/A 400 Centipoise (cP) Nominal Viscosity Electronic Encapsulant | N/A 400 cP | N/A | N/A | N/A |
Unit of Measure
1
