Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.
- UV/Visible/LED Light Cure
- Electrically insulating
- Low stress under thermal cycling
- Secondary heat or moisture-cure formulations available
- Minimize handling and increase throughput with fast curing
- Simple dispense eliminates costs of complex dispensing system maintenance
