COMPANY HEADER
Print Back
Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
Unit of Measure

Specifications

Brands

 N/A Dymax®

Halogen Free?

 N/A Yes

Ultraviolet (UV) Cure Speed

 N/A 15 seconds

Ultraviolet (UV) Cure Depth

 N/A 6.4 mm0.25 in

Note for Ultraviolet (UV) Cure Speed and Depth

 N/A UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.

Uncured Properties

Nominal Viscosity

 N/A 4,500 cP

Cured Mechanical Properties

Durometer Hardness

 N/A D45

Recommended Substrates

Recommended Substrates

 N/A Acrylonitrile Butadiene Styrene (ABS) Flame Retardant (FR-4) Metal Polycarbonate (PC) Polyvinyl chloride (PVC)

Applications

N/A Potting Sealing

Additional Key Features

N/A

  • Full UV/Visible cure in seconds
  • No solvent added
  • High adhesion to substrates
  • Flexible and rigid products available