N/A
Resilient Light-Curable Electronic Assembly/Circuit Board Encapsulant
Multi-Cure® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with good ionic and electrical properties. The encapsulant has a secondary heat cure for applications with shadow areas. This material displays excellent adhesion to PC boards and electronic components and is especially well-suited for chip-on-board, chip-on-flex, and multi-chip modules.
Dymax® materials have no solvents added. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.
|