COMPANY HEADER
Request Information
Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
Unit of Measure

Specifications

Brands

N/A Dymax® Multi-Cure®

Cured Durometer Hardness

N/A D45

Uncured Properties

Uncured Appearance

N/A Colorless Liquid

Nominal Viscosity

N/A 400 cP

Recommended Substrates

Recommended Substrates

N/A Ceramic (CER) Flex Lead frame Printed Circuit Boards (PCB) Silicon

Features

N/A

  • UV/Visible light cure for fastest processing
  • Multi-Cure - secondary heat cure for shadowed areas
  • One part formulation - no mixing
  • Low Tg, low modulus for wire bonding
  • No solvents added
  • Isocyanate free

Additional Information

N/A Resilient Light-Curable Electronic Assembly/Circuit Board Encapsulant

Multi-Cure® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with good ionic and electrical properties. The encapsulant has a secondary heat cure for applications with shadow areas. This material displays excellent adhesion to PC boards and electronic components and is especially well-suited for chip-on-board, chip-on-flex, and multi-chip modules.

Dymax® materials have no solvents added. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.