Multi-Cure® thermal interface adhesives cure in seconds with UV light, heat, and/or activator and are designed for electronics applications where highly conductive bonds to heat-dissipation components on PCBs are critical. The materials can rapidly mount heat-sensitive components to printed circuit boards and bond well to FR4, ceramic, lead frame, PCB, and silicon substrates.

• Light-cure in seconds
• Efficient thermal transfer between heat sinks and electronics
• Secondary activator or heat cure for shadow areas
• High strength, low stress bonds
• Room-temperature storage