Dymax Corp. - Consumer Wearable Adhesives

Unit of Measure

Items	9201-W 32,000 Centipoise (cP) Nominal Viscosity Consumer Wearable Adhesive	9202-W 2,60,000 Centipoise (cP) Nominal Viscosity Consumer Wearable Adhesive	9204-W 30,000 Centipoise (cP) Nominal Viscosity Consumer Wearable Adhesive	9210-W 29,000 Centipoise (cP) Nominal Viscosity Consumer Wearable Adhesive	9211-W 20,000 Centipoise (cP) Nominal Viscosity Consumer Wearable Adhesive
Description	N/A Non-medical-grade electronic adhesives and encapsulants for consumer wearable device assembly cure quickly with light and are designed for applications where skin proximity and sensitivity are a concern. The 9200-W product series is formulated with low sensitizing ingredients, with certain skin irritants such as isobornyl acrylate (IBOA) removed. The materials feature good bonding ability, flexibility, and weatherability and are made for lens alignment, structural bonding, encapsulation of components found in AR/VR headsets, earbuds, and other wearable devices. Cure using UV/LED light Low sensitizing ingredients and skin friendly Light + moisture cure products for shadow area curing One component, so no mixing is required For wearing on the body for short- or long-term periods
Brands	N/A Dymax®
Nominal Viscosity	N/A 32,000 cP	N/A 2,60,000 cP	N/A 30,000 cP	N/A 29,000 cP	N/A 20,000 cP
Uncured Appearance	N/A Colorless	N/A Light Yellow Opaque Paste	N/A Colorless Translucent Liquid	N/A Colorless	N/A Colorless
Cured Elongation at Break	N/A 178 %	N/A 3.6 %	N/A	N/A 28.2 %	N/A 191 %
Cured Linear Shrinkage	N/A	N/A	N/A	N/A 0.85 %	N/A 0.68 %
Recommended Substrates	N/A Flame Retardant (FR-4) Polyethylene Terephthalate (PET) Polymide (PI)	N/A Glass Polycarbonate (PC) Polyethylene Terephthalate (PET) Polymethyl methacrylate (PMMA) Stainless Steel (SS)	N/A Liquid Crystal Polymer (LCP) Polycarbonate (PC) Polystyrene (PS) Silicon	N/A Flame Retardant (FR-4) Polymide (PI) Reliable Pretreatment of Polyamide (PA)	N/A Acrylonitrile Butadiene Styrene (ABS) Flame Retardant (FR-4) Liquid Crystal Polymer (LCP) Polycarbonate (PC)
Cured Durometer Hardness	N/A D20 to D40	N/A D88	N/A A85	N/A D55 to D75	N/A D63
Features	N/A Free of IBOA (isobornyl acrylate), a known skin sensitizer Secondary moisture cure for shadow area curing Cure using UV/Visible light One-part formulation - no mixing No solvents added	N/A Free of IBOA (isobornyl acrylate), a known skin sensitizer Cure using UV/Visible light One-part formulation - no mixing Made with low-sensitizing ingredients No solvents added	N/A Cure using UV/Visible light One-part formulation - no mixing No solvents added	N/A Free of IBOA (isobornyl acrylate), a known skin sensitizer UV Broad spectrum light curable UV LED curable (365 nm or 405 nm) Secondary ambient moisture cure for shadow area curing One-part formulation - no mixing No solvents added	N/A Free of IBOA (isobornyl acrylate), a known skin sensitizer Cures in seconds with UV/Visible light One-part formulation - no mixing No solvents added
Additional Information	N/A High-Viscosity IBOA-Free Electronic Encapsulant with UV Light & Moisture Cure UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable devices and electronics without compromising top quality or performance. 9201-W is designed for applications such as encapsulating wire bonds, chip-on-board, or chip-on-flex circuits. This material provides electrical insulation, chemical, and environmental protection, as well as superior protection through reliability testing such as thermal shock, cycling, and vibration. Once applied to the board, the colorless electronic encapsulant is cured with UV/Visible light within seconds and features a secondary moisture cure for shadow areas. 9201-W IBOA-free encapsulant is in full compliance. See our 2000-MW series of biocompatible IBOA- and TPO-free adhesives for medical wearables assembly.	N/A Low Shrinkage, IBOA Free, UV Curable Optical Alignment Adhesive Designed for optical alignment applications, 9202-W is a next-generation UV cure adhesive formulated with low-sensitizing ingredients designed to produce a safer adhesive for consumer wearable device assembly. Known skin sensitizers such as IBOA (isobornyl acrylate) have been intentionally removed from the product without compromising the top quality or performance associated with Dymax® products. UV light-curable 9202-W adhesive is made for applications such as optical alignment and lens positioning where low shrinkage, high viscosity, and reliability performance are essential to the quality and clarity of an image and/or integrity of the device. When AV/VR headsets, smartwatches, and earbud wearable devices are touching or near the skin, the materials used within them must be the safest as possible for the human body in the event of extreme conditions causing leaching or improper cure. 9202-W optical alignment and lens positioning adhesive is in full compliance. See our 2000-MW series of biocompatible IBOA- and TPO-free adhesives for medical wearables assembly.	N/A Low Shrinkage, Light-Curable Optical Bonding Adhesive Designed for optical bonding applications found in consumer wearables, low-stress 9204-W features very low modulus and low shifting after reliability testing. This optical bonding adhesive is suitable for sealing and packaging due to its high elongation that provides a buffer layer to absorb impact and vibration in optical devices and plastic parts assembly. 9204-W is used to assemble components within smartwatches, earbuds, and AV/VR headsets. In the event of extreme conditions causing leaching or improper cure, this product is designed to be as safe as possible when consumer wearables are touching or near the skin. For medical wearable device assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.	N/A Dual-Cure Electronic Encapsulant Dual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices. The product cures with light energy first and then ambient moisture for parts where shadow areas are present. 9210-W is IBOA-free and formulated with low-sensitizing ingredients to make it as safe as possible when wearables are touching or near the skin. The electronic encapsulation material exhibits great performance in reliability testing and bonds well to typical electronic substrates, including polyimide, polyamide, and FR4. 9210-W dual-cure encapsulant is in full compliance For medical wearable device assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.	N/A Low-Stress Plastic Bonding Adhesive for Camera Module Assembly 9211-W low-stress plastic bonding adhesive cures with UV/Visible light energy for ultra-fast bonding and sealing of camera module components found in consumer wearable devices. This product forms excellent bonds to PC, LCP, ABS, and FR4 substrates and is specifically designed for CCM applications and camera module barrel fixtures. One-component and with no solvents added, 9211-W is a plastic bonding adhesive formulated without IBOA and with low-sensitizing ingredients to be as safe as possible when wearables are touching or close to the skin. 9211-W adhesive is in full compliance. For medical wearables assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.