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Non-medical-grade electronic adhesives and encapsulants for consumer wearable device assembly cure quickly with light and are designed for applications where skin proximity and sensitivity are a concern. The 9200-W product series is formulated with low sensitizing ingredients, with certain skin irritants such as isobornyl acrylate (IBOA) removed. The materials feature good bonding ability, flexibility, and weatherability and are made for lens alignment, structural bonding, encapsulation of components found in AR/VR headsets, earbuds, and other wearable devices.

  • Cure using UV/LED light
  • Low sensitizing ingredients and skin friendly
  • Light + moisture cure products for shadow area curing
  • One component, so no mixing is required
  • For wearing on the body for short- or long-term periods
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity

 N/A 32,000 cP

Uncured Appearance

 N/A Colorless

Cured Elongation at Break

 N/A 178 %

Recommended Substrates

 N/A Flame Retardant (FR-4) Polyethylene Terephthalate (PET) Polymide (PI)

Cured Durometer Hardness

 N/A D20 to D40

Features

Features

 N/A
  • Free of IBOA (isobornyl acrylate), a known skin sensitizer
  • Secondary moisture cure for shadow area curing
  • Cure using UV/Visible light
  • One-part formulation - no mixing
  • No solvents added

Additional Information

Additional Information

 N/A High-Viscosity IBOA-Free Electronic Encapsulant with UV Light & Moisture Cure

UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable devices and electronics without compromising top quality or performance.

9201-W is designed for applications such as encapsulating wire bonds, chip-on-board, or chip-on-flex circuits. This material provides electrical insulation, chemical, and environmental protection, as well as superior protection through reliability testing such as thermal shock, cycling, and vibration.

Once applied to the board, the colorless electronic encapsulant is cured with UV/Visible light within seconds and features a secondary moisture cure for shadow areas.

9201-W IBOA-free encapsulant is in full compliance.

See our 2000-MW series of biocompatible IBOA- and TPO-free adhesives for medical wearables assembly.