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Non-medical-grade electronic adhesives and encapsulants for consumer wearable device assembly cure quickly with light and are designed for applications where skin proximity and sensitivity are a concern. The 9200-W product series is formulated with low sensitizing ingredients, with certain skin irritants such as isobornyl acrylate (IBOA) removed. The materials feature good bonding ability, flexibility, and weatherability and are made for lens alignment, structural bonding, encapsulation of components found in AR/VR headsets, earbuds, and other wearable devices.

  • Cure using UV/LED light
  • Low sensitizing ingredients and skin friendly
  • Light + moisture cure products for shadow area curing
  • One component, so no mixing is required
  • For wearing on the body for short- or long-term periods
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity

 N/A 30,000 cP

Uncured Appearance

 N/A Colorless Translucent Liquid

Recommended Substrates

 N/A Liquid Crystal Polymer (LCP) Polycarbonate (PC) Polystyrene (PS) Silicon

Cured Durometer Hardness

 N/A A85

Features

Features

 N/A
  • Cure using UV/Visible light
  • One-part formulation - no mixing
  • No solvents added

Additional Information

Additional Information

 N/A Low Shrinkage, Light-Curable Optical Bonding Adhesive

Designed for optical bonding applications found in consumer wearables, low-stress 9204-W features very low modulus and low shifting after reliability testing. This optical bonding adhesive is suitable for sealing and packaging due to its high elongation that provides a buffer layer to absorb impact and vibration in optical devices and plastic parts assembly.

9204-W is used to assemble components within smartwatches, earbuds, and AV/VR headsets. In the event of extreme conditions causing leaching or improper cure, this product is designed to be as safe as possible when consumer wearables are touching or near the skin.

For medical wearable device assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.