Brands |
N/A Dymax® |
Nominal Viscosity |
N/A 20,000 cP |
Uncured Appearance |
N/A Colorless |
Cured Elongation at Break |
N/A 191 % |
Cured Linear Shrinkage |
N/A 0.68 % |
Recommended Substrates |
N/A Acrylonitrile Butadiene Styrene (ABS) Flame Retardant (FR-4) Liquid Crystal Polymer (LCP) Polycarbonate (PC) |
Cured Durometer Hardness |
N/A D63 |
Features |
N/A
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Additional Information |
N/A
Low-Stress Plastic Bonding Adhesive for Camera Module Assembly 9211-W low-stress plastic bonding adhesive cures with UV/Visible light energy for ultra-fast bonding and sealing of camera module components found in consumer wearable devices. This product forms excellent bonds to PC, LCP, ABS, and FR4 substrates and is specifically designed for CCM applications and camera module barrel fixtures. One-component and with no solvents added, 9211-W is a plastic bonding adhesive formulated without IBOA and with low-sensitizing ingredients to be as safe as possible when wearables are touching or close to the skin. 9211-W adhesive is in full compliance. For medical wearables assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives. |