Multi-Cure® potting adhesives cure rapidly upon UV/Visible light exposure and feature a secondary heat-cure or activator-cure function for shadow areas on PCBs. These potting compounds exhibit translucent bonds and provide excellent adhesion to engineered plastics for connector, thermal switch, and sensor potting, and can be utilized for tamper proofing applications. Bondable substrates include many types of phenolic, thermoset, and filled plastics as well as ceramic, glass, and metal.

• UV/Visible light cure
• Secondary heat-cure or activator cure capability
• No solvents added
• Wide array of bondable substrates
• 10-30-second tack-free cures