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Multi-Cure® potting adhesives cure rapidly upon UV/Visible light exposure and feature a secondary heat-cure or activator-cure function for shadow areas on PCBs. These potting compounds exhibit translucent bonds and provide excellent adhesion to engineered plastics for connector, thermal switch, and sensor potting, and can be utilized for tamper proofing applications. Bondable substrates include many types of phenolic, thermoset, and filled plastics as well as ceramic, glass, and metal.

  • UV/Visible light cure
  • Secondary heat-cure or activator cure capability
  • No solvents added
  • Wide array of bondable substrates
  • 10-30-second tack-free cures
Unit of Measure

Specifications

Brands

 N/A Dymax® Multi-Cure®

Recommended Substrates

 N/A Acrylonitrile Butadiene Styrene (ABS) Filled Nylon Glass (GL) Metal

Ultraviolet (UV) Cure Speed

 N/A 30 seconds

Ultraviolet (UV) Cure Depth

 N/A 6.4 mm0.25 in

Note for Ultraviolet (UV) Cure Speed and Depth

 N/A UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.

Durometer Hardness

 N/A D75

Nominal Viscosity

 N/A 3,500 cP

Halogen Free?

 N/A Yes

Applications

N/A Potting Sealing