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Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
Unit of Measure

Specifications

Brands

 N/A Dymax®

Halogen Free?

 N/A Yes

Uncured Properties

Solvent Content

N/A No Nonreactive Solvents

Chemical Class

N/A Acrylated Urethane

Uncured Appearance

 N/A Translucent Gel

Soluble in

N/A Organic Solvents

Density

 N/A 1.06 g/ml

Test Method for Density

 N/A American Society for Testing and Materials (ASTM D1875)

Nominal Viscosity

 N/A 55,000 cP

Test Method for Nominal Viscosity at 20 Revolutions Per Minute (rpm) Speed

 N/A American Society for Testing and Materials (ASTM D2556)

Shelf Life at Room Temperature (RT) (22 to 25 Degree Celsius (ºC)) Temperature from Date of Manufacture

 N/A 12 months

Cured Mechanical Properties

Durometer Hardness

 N/A D40

Test Method for Durometer Hardness

 N/A American Society for Testing and Materials (ASTM D2240)

Tensile at Break

 N/A 5.8 MPa850 psi

Test Method for Tensile at Break

 N/A American Society for Testing and Materials (ASTM D638)

Elongation at Break

 N/A 110 %

Test Method for Elongation at Break

 N/A American Society for Testing and Materials (ASTM D638)

Modulus of Elasticity

 N/A 6.2 MPa900 psi

Test Method for Modulus of Elasticity

 N/A American Society for Testing and Materials (ASTM D638)

Glass Transition Temperature (Tg)

 N/A 31 ºC

Test Method for Glass Transition Temperature (Tg)

 N/A American Society for Testing and Materials (ASTM D5418)

Coefficient of Thermal Expansion (CTEα1)

 N/A 126 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα1)

 N/A American Society for Testing and Materials (ASTM D831)

Coefficient of Thermal Expansion (CTEα2)

 N/A 171 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα2)

 N/A American Society for Testing and Materials (ASTM E831)

Other Cured Properties

Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A 1.50

Test Method for Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A American Society for Testing and Materials (ASTM D542)

Boiling Water Absorption (2 Hours (h))

 N/A 2.0 %

Test Method for Boiling Water Absorption (2 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A 0.9 %

Test Method for Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Linear Shrinkage

 N/A 2.2 %

Test Method for Linear Shrinkage

 N/A American Society for Testing and Materials (ASTM D2566)

Electrical Properties

Dielectric Constant at 1 Megahertz (MHz) Frequency

 N/A 4.31

Test Method for Dielectric Constant at 1 Megahertz (MHz) Frequency

 N/A American Society for Testing and Materials (ASTM D150)

Dissipation Factor at 1 Megahertz (MHz) Frequency

 N/A 0.03

Test Method for Dissipation Factor at 1 Megahertz (MHz) Frequency

 N/A American Society for Testing and Materials (ASTM D150)

Dielectric Breakdown Voltage

 N/A 900 V/mil

Test Method for Dielectric Breakdown Voltage

 N/A American Society for Testing and Materials (ASTM D149)

Volume Resistivity

 N/A 2.59E+10 O·cm

Test Method for Volume Resistivity

 N/A American Society for Testing and Materials (ASTM D257)

Surface Resistivity

 N/A 9.44E+10 O

Test Method for Surface Resistivity

 N/A American Society for Testing and Materials (ASTM D257)

Recommended Dispense Equipment

Recommended Dispense Equipment

 N/A Application - Dots/Beads
Manual - SD-100
Semi-Automated - Model 400 Valve
Fully Automated - eco-PEN450

Recommended Curing Equipment

N/A Spot Lamp
LED Curing - BlueWave® MX-150
Wavelength (PrimeCure®) - 385 nm
Broad Spectrum - BlueWave® 200

Flood Lamp
LED Curing - BlueWave® AX-550
Wavelength (PrimeCure®) - 385 nm
Broad Spectrum - 5000-ECE

Conveyor
LED Curing - UVCS Conveyor with LED Floods
Broad Spectrum - UVCS Conveyor

Recommended Substrates

Recommended Substrates

 N/A Flame Retardant (FR-4) Glass (GL) Kapton

Recommended Adhesives

Recommended Adhesives

 N/A Aluminum (AL) (Limited Applications) Flame Retardant (FR-4) Printed Circuit Board (PCB)

Applications

N/A

  • Chip on Board
  • Chip on Flex
  • Chip on Glass
  • Wire Bonding

Features

N/A

  • UV/Visible Light Cure
  • Secondary Heat Cure
  • Flexible Encapsulant
  • Shadow Area Performance
  • Moisture and Thermal Resistance
  • Blue Fluorescing

Additional Information

N/A When cured with Dymax® light-curing spot lamps, focused-beam lamps, or flood lamps, they deliver optimum speed and performance for device assembly. Dymax® lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.