Multi-Cure® potting adhesives cure rapidly upon UV/Visible light exposure and feature a secondary heat-cure or activator-cure function for shadow areas on PCBs. These potting compounds exhibit translucent bonds and provide excellent adhesion to engineered plastics for connector, thermal switch, and sensor potting, and can be utilized for tamper proofing applications. Bondable substrates include many types of phenolic, thermoset, and filled plastics as well as ceramic, glass, and metal.
- UV/Visible light cure
- Secondary heat-cure or activator cure capability
- No solvents added
- Wide array of bondable substrates
- 10-30-second tack-free cures
| Items |
 921-T 3,500 Centipoise (cP) Nominal Viscosity Electronic Potting Adhesives |
921-VT 11,000 Centipoise (cP) Nominal Viscosity Electronic Potting Adhesives |
921-GEL 25,000 Centipoise (cP) Nominal Viscosity Electronic Potting Adhesives |
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| Description |
Multi-Cure® potting adhesives cure rapidly upon UV/Visible light exposure and feature a secondary heat-cure or activator-cure function for shadow areas on PCBs. These potting compounds exhibit translucent bonds and provide excellent adhesion to engineered plastics for connector, thermal switch, and sensor potting, and can be utilized for tamper proofing applications. Bondable substrates include many types of phenolic, thermoset, and filled plastics as well as ceramic, glass, and metal.
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| Brands | Dymax® Multi-Cure® | |||||
| Recommended Substrates | Acrylonitrile Butadiene Styrene (ABS) Filled Nylon Glass (GL) Metal | |||||
| Ultraviolet (UV) Cure Speed | 30 seconds | |||||
| Ultraviolet (UV) Cure Depth | 6.4 mm0.25 in | |||||
| Note for Ultraviolet (UV) Cure Speed and Depth | UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2. | |||||
| Durometer Hardness | D75 | |||||
| Nominal Viscosity | 3,500 cP | 11,000 cP | 25,000 cP | |||
| Halogen Free? | Yes | |||||
| Applications | Potting Sealing | |||||
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