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Light-cure conformal coatings cure tack-free in seconds upon exposure to UV/Visible or LED light and feature secondary heat or moisture-cure capability for shadow areas on PCBs. They protect printed circuit boards and components from extreme environmental conditions such as heat, chemicals, and humidity.

  • UV/Visible/LED light cure in seconds
  • Multi-Cure and Dual-Cure products (secondary heat or moisture cure)
  • High visibility fluorescence for inline Q.C.
  • One-part formulations, no solvents added
  • IPC and MIL SPEC approvals; some meet NASA ASTM E595 Low Outgassing
  • Flexible and rigid bonds to FPB and PCB substrates
  • Temperature/humidity resistance
  • Black coatings to hide sensitive circuitry
Unit of Measure

Specifications

Brands

 N/A Dymax®

Uncured Properties

Solvent Content

N/A No Non-reactive Solvents

Chemical Class

N/A Acrylated Urethane

Uncured Appearance

 N/A Clear Light Yellow Liquid

Soluble in

N/A Organic Solvents

Density

 N/A 1.09 g/ml

Test Method for Density

 N/A American Society for Testing and Materials (ASTM D1875)

Nominal Viscosity

 N/A 750 cP

Test Method for Nominal Viscosity at 20 Revolutions Per Minute (rpm) Speed

 N/A Dymax® Standard Test Method (DSTM 502)

Shelf Life at Room Temperature (RT) (22 to 25 Degree Celsius (ºC)) Temperature from Date of Manufacture

 N/A 7 months

Cured Mechanical Properties

Durometer Hardness (Ultraviolet (UV) Only)

 N/A A55

Test Method for Durometer Hardness (Ultraviolet (UV) Only)

 N/A American Society for Testing and Materials (ASTM D2240)

Durometer Hardness

 N/A D60

Test Method for Durometer Hardness

 N/A American Society for Testing and Materials (ASTM D2240)

Tensile at Break

 N/A 16.2 MPa2,350 psi

Test Method for Tensile at Break

 N/A American Society for Testing and Materials (ASTM D638)

Elongation at Break

 N/A 22 %

Test Method for Elongation at Break

 N/A American Society for Testing and Materials (ASTM D638)

Modulus of Elasticity

 N/A 276 MPa40,000 psi

Test Method for Modulus of Elasticity

 N/A American Society for Testing and Materials (ASTM D638)

Other Cured Properties

Glass Transition Temperature (Tg)

 N/A 57 ºC

Test Method for Glass Transition Temperature (Tg)

 N/A American Society for Testing and Materials (ASTM D5418)

Coefficient of Thermal Expansion (CTEα1)

 N/A 87 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα1)

 N/A American Society for Testing and Materials (ASTM E831)

Coefficient of Thermal Expansion (CTEα2)

 N/A 188 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα2)

 N/A American Society for Testing and Materials (ASTM E831)

Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A 1.51

Test Method for Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A American Society for Testing and Materials (ASTM D542)

Boiling Water Absorption (2 Hours (h))

 N/A 1.4 %

Test Method for Boiling Water Absorption (2 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A 0.3 %

Test Method for Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Linear Shrinkage

 N/A 2.0 %

Test Method for Linear Shrinkage

 N/A American Society for Testing and Materials (ASTM D2566)

Thermal Shock (-65 to 125 Degree Celsius (ºC)) Temperature

 N/A 50 cycles

Test Method for Thermal Shock (-65 to 125 Degree Celsius (ºC)) Temperature

 N/A Military Standard (MIL-I-46058C)

Moisture Resistance

 N/A Passes

Test Method for Moisture Resistance

 N/A Military Standard (MIL-I-46058C)

Fungus Resistance (American Society for Testing and Materials (ASTM G21-13))

 N/A Passes

Test Method for Fungus Resistance (American Society for Testing and Materials (ASTM G21-13))

 N/A Military Standard (MIL-I-46058C)

Flammability

 N/A V0

Test Method for Flammability

N/A Underwriters Laboratories (UL 94)

Electrical Properties

Dielectric Constant at 1 Megahertz (MHz) Frequency

 N/A 3.26

Test Method for Dielectric Constant at 1 Megahertz (MHz) Frequency

 N/A American Society for Testing and Materials (ASTM D150)

Dissipation Factor at 1 Megahertz (MHz) Frequency

 N/A 0.2

Test Method for Dissipation Factor at 1 Megahertz (MHz) Frequency

 N/A American Society for Testing and Materials (ASTM D150)

Surface Resistivity

 N/A 2.22E+12 O

Test Method for Surface Resistivity

 N/A American Society for Testing and Materials (ASTM D257)

Volume Resistivity

 N/A 4.39E+14 O·cm

Test Method for Volume Resistivity

 N/A American Society for Testing and Materials (ASTM D257)

Dielectric Withstand Voltage

 N/A 59 kV/mm1500 V/mil

Test Method for Dielectric Withstand Voltage

N/A American Society for Testing and Materials (ASTM D149)

Recommended Adhesives

Recommended Adhesives

 N/A Ceramic (CER) Flex Lead Frame Printed Circuit Board (PCB)

Other Features

N/A

  • Bright Blue Fluorescing
  • UL 94V-0 Flammability
  • UL 746-E
  • MIL-I-46058C Listed
  • Meets IPC-CC-830B

Applications

N/A

  • Conformal Coatings
  • Automotive Sensors
  • Control Modules

Additional Information

N/A Dymax® dual-cure materials contain no nonreactive solvents. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.When cured with Dymax® light-curing focused-beam lamps or flood lamps, they deliver optimum speed and performance for electronic assembly. Dymax® lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.

Features

N/A

  • UV/Visible Light Cure
  • Secondary Moisture Cure
  • Excellent Thermal Shock Resistance
  • Corrosion Resistant
  • Temperature/Humidity Performance