COMPANY HEADER
SpeedMask® peelable masks have no solvents added and are designed for the masking of printed circuit board components prior to conformal coating application or wave solder and reflow processes. They cure in seconds "on-demand" when exposed to UV/Visible light. The fast cure allows boards to be immediately processed without the need for racking or waiting. After proper cure, the materials leave no silicone, ionic contamination, or corrosive residues behind. SpeedMask® maskants used to protect PCB substrates including FR-4, ceramic, gold fingers or frames, and connectors as well as the many materials used in the manufacture of electronic components.

  • UV/Visible light cure
  • Replace labor-intensive application of waxes, tapes, lacquers
  • Spray, dip, or screen print application
  • Conform to complex and intricate configurations
  • Apply, cure, treat, and remove in 4 easy steps
  • New components and design changes require no additional investment
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Item #

Item Name

Cure Depth

Durometer Hardness

Cure Speed

Viscosity

N/A SpeedMask® 0.19 Inch (in) Cure Depth Peelable Mask N/A 4.90 mm0.19 in N/A A75 N/A 1 seconds N/A 125,000 cP
N/A SpeedMask® 0.25 Inch (in) Cure Depth Peelable Mask N/A 6.40 mm0.25 in N/A A55 N/A < 4 seconds N/A 50,000 cP
N/A SpeedMask® 0.33 Inch (in) Cure Depth Peelable Mask N/A 8.36 mm0.33 in N/A A70 N/A 1 seconds N/A 40,000 cP
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