SpeedMask® peelable masks have no solvents added and are designed for the masking of printed circuit board components prior to conformal coating application or wave solder and reflow processes. They cure in seconds "on-demand" when exposed to UV/Visible light. The fast cure allows boards to be immediately processed without the need for racking or waiting. After proper cure, the materials leave no silicone, ionic contamination, or corrosive residues behind. SpeedMask® maskants used to protect PCB substrates including FR-4, ceramic, gold fingers or frames, and connectors as well as the many materials used in the manufacture of electronic components.
SpeedMask® maskants have no solvents added and are designed to protect metal components prior to surface finishing processes. The masks are applied in one layer and cure in seconds "on-demand" when exposed to UV/Visible light. They are designed to protect components from harsh grit blasting, acid stripping, laser drilling, and chemical processing. Many maskants feature bright colors to enable easy visual placement onto substrates. After proper cure, the materials also leave no silicone, ionic contamination, or corrosive residues behind. Recommended surfaces include nickel superalloys, high-temperature steel, titanium, cobalt, and stainless steel.
