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SpeedMask® peelable masks have no solvents added and are designed for the masking of printed circuit board components prior to conformal coating application or wave solder and reflow processes. They cure in seconds "on-demand" when exposed to UV/Visible light. The fast cure allows boards to be immediately processed without the need for racking or waiting. After proper cure, the materials leave no silicone, ionic contamination, or corrosive residues behind. SpeedMask® maskants used to protect PCB substrates including FR-4, ceramic, gold fingers or frames, and connectors as well as the many materials used in the manufacture of electronic components.

  • UV/Visible light cure
  • Replace labor-intensive application of waxes, tapes, lacquers
  • Spray, dip, or screen print application
  • Conform to complex and intricate configurations
  • Apply, cure, treat, and remove in 4 easy steps
  • New components and design changes require no additional investment
Unit of Measure

Specifications

Brands

 N/A Dymax® SpeedMask®
Cure Depth1 N/A 6.40 mm0.25 in

Durometer Hardness

 N/A A55
Cure Speed2 N/A < 4 seconds

Viscosity

 N/A 50,000 cP

Tensile at Break

 N/A 3.0 MPa440 psi

Elongation at Break

 N/A 130 %

Halogen Free?

 N/A Yes

Additional Key Features

N/A

  • Non-ionic
  • UV/Visible light cure in seconds for faster processing
  • Bright colors for high visibility
  • Fluorescing grades for easy in-line inspection
  • One part, no solvents added - no mixing
  • Rapid cure speeds allow for flexibility in production volumes
  • 1 5 second cure
  • 2 Cure speed depends on the intensity and distance from the light source. Cure speed was measured at an intensity of 175 mW/cm2.