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Multipurpose medical device adhesives are designed to rapidly bond medical-grade plastics upon exposure to UV/Visible light. The products meet ISO approvals and bond well to many different substrates including tinted and UV-inhibited plastics. Some formulations feature patented Encompass® technology which enables easy visual confirmation of adhesive placement and cure and fluorescence for post-cure quality inspection.

  • UV/Visible/LED light cure
  • ISO 10993 compliant
  • Compatible with E-Beam, gamma, and EtO sterilization
  • Single-component materials require no mixing
  • Secondary heat-cure capability for shadow areas (some products)
  • See-Cure technology for cure confirmation (some products)
  • Blue or Ultra-Red® fluorescing for quality inspection (some products)
Unit of Measure

Specifications

Brands

 N/A Dymax® MD®

Nominal Viscosity

 N/A 775 cP

Cured Durometer Hardness

 N/A D60

Cured Elongation at Break

 N/A 8 %

Recommended Substrates

 N/A Acrylonitrile Butadiene Styrene (ABS) Polycyclohexylene Dimethylene Terephthalate Glycol (PCTG) Polymethyl methacrylate (PMMA) Printed Circuit Board (PCB) Stainless Steel (SS)

Biocompatibility

 N/A ISO 10993-5 Cytotoxicity

Properties

Rheology

 N/A Newtonian

Tensile at Break

 N/A 18.6 MPa2,700 psi

Modulus of Elasticity

 N/A 668.8 MPa97,000 psi

Substrate Bonding Guide

Recommended Adhesives

 N/A Acrylonitrile-Butadiene-Styrene (ABS) Aluminum (AL) Borosilicate Glass (GL), Quartz Glass (GL), and Mica Glass (GL) Brass (BR) Cellulose Acetate Propionate (CAP) (Limited Applications) Polycarbonate (PC) Polycyclohexylene Dimethylene Terephthalate Glycol (PCTG) Polyimide (PI) (Limited Applications) Polymethyl Methacrylate (PMMA) Polyphenylene Oxide (PPO) Polystyrene (PS) (Limited Applications) Stainless Steel (SS) Styrene-Acrylonitrile (SAN) Thermoplastic Polyurethane (TPU) (Limited Applications)

Uncured Properties

Solvent Content

N/A No Nonreactive Solvents

Chemical Class

N/A Acrylated Urethane

Uncured Appearance

 N/A Colorless to Light-Yellow

Soluble in

N/A Organic Solvents

Density

 N/A 0.99 g/ml

Test Method for Density

 N/A American Society for Testing and Materials (ASTM D1875)

Test Method for Nominal Viscosity

 N/A American Society for Testing and Materials (ASTM D1084)

Shelf Life at Room Temperature (RT) (22 to 25 Degree Celsius (ºC)) Temperature from Date of Manufacture

 N/A 9 months

Cured Mechanical Properties

Test Method for Durometer Hardness

 N/A American Society for Testing and Materials (ASTM D2240)

Test Method for Tensile at Break

 N/A American Society for Testing and Materials (ASTM D638)

Test Method for Elongation at Break

 N/A American Society for Testing and Materials (ASTM D638)

Test Method for Modulus of Elasticity

 N/A American Society for Testing and Materials (ASTM D638)

Other Cured Properties

Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A 1.49

Test Method for Refractive Index at 20 Degree Celsius (ºC) Temperature

 N/A American Society for Testing and Materials (ASTM D542)

Boiling Water Absorption (2 Hours (h))

 N/A 1.6 %

Test Method for Boiling Water Absorption (2 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A 0.5 %

Test Method for Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h))

 N/A American Society for Testing and Materials (ASTM D570)

Linear Shrinkage

 N/A 0.8 %

Test Method for Linear Shrinkage

 N/A American Society for Testing and Materials (ASTM D2566)

Glass Transition Temperature (Tg)

 N/A 115 ºC

Test Method for Glass Transition Temperature (Tg)

 N/A American Society for Testing and Materials (ASTM D5418)

Coefficient of Thermal Expansion (CTEα1)

 N/A 121 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα1)

 N/A American Society for Testing and Materials (ASTM E831)

Coefficient of Thermal Expansion (CTEα2)

 N/A 194 µm/m/ºC

Test Method for Coefficient of Thermal Expansion (CTEα2)

 N/A American Society for Testing and Materials (ASTM E831)

Applications

N/A

  • Assemblies Requiring Repeat Sterilization
  • RFID and Sensor Potting/Encapsulation
  • Housing Assemblies
  • Medical PCB Coating

Features

Features

 N/A
  • UV/Visible Light Cure
  • LED UV Curable at 365 nm
  • Survives Repeated Autoclave Cycles
  • Low Water Absorption

Additional Information

Additional Information

 N/A Autoclave Resistant Encapsulant, Potting and Bonding Adhesive

Dymax® MD® 1040-M is a versatile autoclave resistant adhesive, coating and encapsulant resistant to 100+ cycles of sterilization. It offers extremely low water absorption (0.5%) making it ideal for surgical tools and devices that are subjected to numerous instances of sterilization, including autoclave or STERRAD™ Hydrogen Peroxide-Plasma. This material is effectively used for medical sensor encapsulations and potting of electronic components, where moisture ingression may be of concern.

MD® 1040-M medical device coating is recommended for use as a coating or encapsulant on RFID chips, for surgical tools, housing assemblies and single-use or multiple use medical devices requiring 100+ cycles of autoclave. Additional applications include a variety of medical scopes and dental equipment. It also successfully bonds to stainless steel, aluminum, glass, PP/PE and printed circuit boards.

The material is compliant with ISO 10993-5 cytotoxicity standards and is also formulated without IBOA, a known skin irritant. It has no solvents added and cures in seconds upon exposure to broad-spectrum UV or 365nm LED light.

STERRAD™ is a registered trademark of ASP Global Manufacturing, GmbH.