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Non-medical-grade electronic adhesives and encapsulants for consumer wearable device assembly cure quickly with light and are designed for applications where skin proximity and sensitivity are a concern. The 9200-W product series is formulated with low sensitizing ingredients, with certain skin irritants such as isobornyl acrylate (IBOA) removed. The materials feature good bonding ability, flexibility, and weatherability and are made for lens alignment, structural bonding, encapsulation of components found in AR/VR headsets, earbuds, and other wearable devices.

  • Cure using UV/LED light
  • Low sensitizing ingredients and skin friendly
  • Light + moisture cure products for shadow area curing
  • One component, so no mixing is required
  • For wearing on the body for short- or long-term periods
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity

 N/A 29,000 cP

Uncured Appearance

 N/A Colorless

Cured Elongation at Break

 N/A 28.2 %

Cured Linear Shrinkage

 N/A 0.85 %

Recommended Substrates

 N/A Flame Retardant (FR-4) Polymide (PI) Reliable Pretreatment of Polyamide (PA)

Cured Durometer Hardness

 N/A D55 to D75

Features

Features

 N/A
  • Free of IBOA (isobornyl acrylate), a known skin sensitizer
  • UV Broad spectrum light curable
  • UV LED curable (365 nm or 405 nm)
  • Secondary ambient moisture cure for shadow area curing
  • One-part formulation - no mixing
  • No solvents added

Additional Information

Additional Information

 N/A Dual-Cure Electronic Encapsulant

Dual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices.

The product cures with light energy first and then ambient moisture for parts where shadow areas are present. 9210-W is IBOA-free and formulated with low-sensitizing ingredients to make it as safe as possible when wearables are touching or near the skin.

The electronic encapsulation material exhibits great performance in reliability testing and bonds well to typical electronic substrates, including polyimide, polyamide, and FR4.

9210-W dual-cure encapsulant is in full compliance

For medical wearable device assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.