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Adhesives for medical wearable device assembly are formulated without IBOA (isobornyl acrylate), a known skin irritant and TPO, a material of concern. The 2000-MW series of products cures with UV/LED light to seal, encapsulate, coat, and bond components in medical wearables such as drug delivery devices. The materials pass ISO 10993-10 / -23 for sensitization and irritation and ISO 10993-5 for cytotoxicity and bond to PC, PVC, SS, PI, TPU and other difficult-to-bond-to substrates.

  • Cure with UV/LED light in seconds
  • Skin friendly - free of IBOA
  • Formulated without TPO
  • Pass ISO 10993-5 Cytotoxicity
  • One-part formulations require no mixing
  • Pass ISO 10993-10 / -23 for sensitization & irritation
  • Biocompatible formulations
Unit of Measure

Specifications

Brands

 N/A Dymax®

Nominal Viscosity at 20 Revolutions Per Minute (rpm) Speed

 N/A 700 cP

Cured Durometer Hardness

 N/A D60

Cured Elongation at Break

 N/A 8 %

Recommended Substrates

 N/A Acrylonitrile Butadiene Styrene (ABS) Aluminum Glass Polycarbonate (PC) Polyethylene Terephthalate Glycol (PETG) Polymide (PI) Polyurethane (PU) Stainless Steel (SS) Styrene-Acrylonitrile (SAN)

Features

Features

 N/A
  • Low water absorption: 0.5%
  • Biocompatible 10993-5 cytotoxicity standards
  • IBOA Free (designed without isobornyl acrylate)
  • UV/Broad Spectrum and LED curable at 365nm
  • Superior adhesion to a wide range of substrates
  • No solvents added

Additional Information

Additional Information

 N/A Low Water Absorption Encapsulant, Coating and Bonding Adhesive for Wearable Medical Devices

Dymax® 2022-MW is a versatile general bonding adhesive, coating, and encapsulant with low water absorption and minimized water ingression. It offers extremely low water absorption of 0.5% making it ideal for the assembly or encapsulation of electronic wearable medical device components.

Formulated without IBOA, a known skin irritant, and TPO, a material of concern, 2022-MW is compliant with ISO 10993-5 for cytotoxicity standards. This classification makes it an ideal material for wearable medical devices where proximity to the skin for extended periods of time is a concern.

2022-MW is recommended for use as a coating or encapsulant on RFID chips or sensors housing assemblies and single- or multi-use medical devices where moisture ingression is a concern. It bonds well to stainless steel, aluminum, glass, and printed circuit boards.

This material has no solvents added and cures in seconds upon exposure to broad-spectrum UV or 365 nm LED light.