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UV/LED light-curable adhesives bond glass and other difficult substrates such as COC/COP thermoplastics used for in-vitro diagnostics applications. Rapid assembly of microplates, lab-on-chip devices, and silicon wafers used in blood and tissue testing is possible with fast light curing, one-component formulations that require no mixing. Products with Dymax® Ecnompass® or patented See-Cure and Ultra-Red® fluorescing technologies are available.

  • UV/Visible broad-spectrum bulb or LED array curing
  • Moisture-resistant formulations (some products)
  • Bond rigid and flexible substrates
  • Encompass, See-Cure, or Ultra-Red® technologies
  • Adhere to difficult substrates like COC/COP
Unit of Measure

Specifications

Brands

 N/A Dymax® MD®

Nominal Viscosity

 N/A 1,000 cP

Recommended Substrates

 N/A Cyclo Olefin Copolymer (COC) Cyclo Olefin Polymer (COP) Polystyrene (PS) Polyurethane (PU) Polyvinyl chloride (PVC) Stainless Steel (SS)

Properties

Rheology

 N/A Newtonian

Durometer Hardness

 N/A A58

Tensile at Break

 N/A 4.8 MPa700 psi

Elongation at Break

 N/A 700 %

Modulus of Elasticity

 N/A 3.4 MPa500 psi
Fluorescing1 N/A No

Substrate Bonding Guide

Recommended Adhesives

 N/A Acrylonitrile-Butadiene-Styrene (ABS) Borosilicate Glass (GL), Quartz Glass (GL), and Mica Glass (GL) Cyclo Olefin Polymer/Copolymer: (COP) Poly Methyl Methacrylate (PMMA) Polyamide (PA) Polycarbonate (PC) Polyether Block Amide (PEBA) Polyetherimide (PEI) Polyethylene Terephthalate (PET) Polyethylene Terephthalate Glycol (PETG) Polyimide (PI) Polystyrene (PS) Polysulfone (PSU) Polyurethane (PU) Polyvinyl Chloride (PVC) Stainless Steel (SS) Styrene-Acrylonitrile (SAN) Thermoplastic Polyurethane (TPU)

Limited Applications

 N/A Polyetherimide (PEI)

Industries Served

N/A Medical

Additional Information

Additional Information

 N/A Dymax® MD® Adhesives, specially formulated for disposable medical device assembly, are used in a wide range of applications including catheter, syringe, anesthesia mask, reservoir, tube set, and medical electronics assembly. They help optimize assembly speeds to enable faster processing, greater output, and lower processing costs while allowing for 100% in-line inspection of bond lines. All of our adhesives are no solvents added, and meet both USP Class VI and ISO 10993 biocompatibility standards.

MD® adhesives are intended for use in short-term (<29 days) or single-use disposable-device applications only. Dymax® does not authorize their use in long-term implant applications. In all cases, it's the user's responsibility to determine and validate the suitability of these adhesives in the intended medical device.

Compatible sterilization methods include gamma irradiation and ethylene oxide. Sterilization by autoclaving may be limited to certain applications. It remains the user's obligation to ascertain the effect of sterilization on the cured adhesive.

Note

N/A Individual Product Data Sheets (PDS) list complete test data, with copies of test reports available upon request.

  • 1 U.S. Patents 6,080,450 & 7,892,386