Nominal Viscosity |
N/A 30 to 40 cP |
Closed Cup Flash Point |
N/A 245 ºF118 ºC |
Specific Gravity |
N/A 1.0 |
Features |
N/A
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Additional Information |
N/A
Activator for Fast, Reliable Structural Bonding 501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates including printed circuit boards or PCBs, rapidly cures Multi-Cure® 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils. Activator bonding increases efficiency, consistency, and reliability and provides broad tolerance of adhesive-to-activator ratios. Dymax® metal bonding adhesives develop bond strengths up to 3,500 psi in 10 to 30 seconds between opaque surfaces when an adhesive activator is pre-applied to metal substrates.
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