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MD® catheter adhesives cure with UV/Visible or LED light in seconds to quickly bond common substrates such as ABS, PA, glass, PC, stainless steel, nitinol, aluminum, polyurethane used in catheter assembly. These adhesive meet or exceed ISO 10993 standards and are compatible with EtO, E-Beam, and gamma sterilization. Applications include balloon bonding, marker bands, and Y-connectors. Formulations are available with See-Cure, Ultra-Red®, or Encompass® technology for easy verification of adhesive placement, cure, and inspection.

  • Cure in seconds with UV/Visible/LED light
  • One-part formulations and no mixing
  • ISO 10993 and other biocompatible approvals
  • Formulations with See-Cure, Ultra-Red®, or Encompass® technologies
  • Secondary heat-cure capability for shadow areas
  • Bond a broad range of substrates including Nylon 12 and PEBA
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Unit of Measure
Items
Catheter Adhesives

MD® 200 Series 55 Centipoise (cP) Nominal Viscosity CTH Adhesive for Catheter Assembly
Catheter Adhesives

MD® 200 Series 600 Centipoise (cP) Nominal Viscosity CTH Adhesive for Catheter Assembly
Catheter Adhesives

MD® 200 Series 3,250 Centipoise (cP) Nominal Viscosity CTH Adhesive for Catheter Assembly
Catheter Adhesives

MD® 200 Series 11,000 Centipoise (cP) Nominal Viscosity CTH Adhesive for Catheter Assembly
Catheter Adhesives

MD® 200 Series 300 Centipoise (cP) Nominal Viscosity CTH Adhesive for Catheter Assembly
Description N/A MD® catheter adhesives cure with UV/Visible or LED light in seconds to quickly bond common substrates such as ABS, PA, glass, PC, stainless steel, nitinol, aluminum, polyurethane used in catheter assembly. These adhesive meet or exceed ISO 10993 standards and are compatible with EtO, E-Beam, and gamma sterilization. Applications include balloon bonding, marker bands, and Y-connectors. Formulations are available with See-Cure, Ultra-Red®, or Encompass® technology for easy verification of adhesive placement, cure, and inspection.

  • Cure in seconds with UV/Visible/LED light
  • One-part formulations and no mixing
  • ISO 10993 and other biocompatible approvals
  • Formulations with See-Cure, Ultra-Red®, or Encompass® technologies
  • Secondary heat-cure capability for shadow areas
  • Bond a broad range of substrates including Nylon 12 and PEBA
Brands N/A Dymax® MD®
Rheology N/A Newtonian N/A Newtonian N/A Thixotropic N/A Thixotropic N/A Newtonian
Fluorescing1 N/A Blue
Solvent Content N/A
Chemical Class N/A
Uncured Appearance N/A
Soluble in N/A
Density N/A
Test Method for Density N/A
Nominal Viscosity N/A 55 cP N/A 600 cP N/A 3,250 cP N/A 11,000 cP N/A 300 cP
Test Method for Nominal Viscosity N/A
Shelf Life at 1 to 5 Degree Celsius (ºC) Temperature from Date of Manufacture N/A
Durometer Hardness N/A D85 N/A D80 N/A D80 N/A D80 N/A D70
Test Method for Durometer Hardness N/A
Tensile at Break N/A 32 MPa4,600 psi N/A 30 MPa4,300 psi N/A 26 MPa3,800 psi N/A 28 MPa4,100 psi N/A 17 MPa2,500 psi
Test Method for Tensile at Break N/A
Elongation at Break N/A 7 % N/A 13 % N/A 2.6 % N/A 8 % N/A 120 %
Test Method for Elongation at Break N/A
Modulus of Elasticity N/A 640 MPa93,000 psi N/A 640 MPa93,000 psi N/A 630 MPa92,000 psi N/A 550 MPa80,000 psi N/A 300 MPa44,000 psi
Test Method for Modulus of Elasticity N/A
Boiling Water Absorption (2 Hours (h)) N/A
Test Method for Boiling Water Absorption (2 Hours (h)) N/A
Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h)) N/A
Test Method for Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h)) N/A
Linear Shrinkage N/A
Test Method for Linear Shrinkage N/A
Glass Transition Temperature (Tg) N/A
Test Method for Glass Transition Temperature (Tg) N/A
Coefficient of Thermal Expansion (CTEα1) N/A
Test Method for Coefficient of Thermal Expansion (CTEα1) N/A
Coefficient of Thermal Expansion (CTEα2) N/A
Test Method for Coefficient of Thermal Expansion (CTEα2) N/A
Biocompatibility N/A
Recommended Adhesives N/A Acrylonitrile-Butadiene-Styrene (ABS) Nickel Titanium (NiTi) Polyamide (Nylon 6/6) (PA) Polyether Block Amide (PEBA) Polyetherimide (PEI) Polystyrene (PS) Polysulfone (PSU) Polyurethane (PU) Silicone (SIL) Styrene-Acrylonitrile (SAN) N/A Acrylonitrile-Butadiene-Styrene (ABS) Nickel Titanium (NiTi) Polyamide (Nylon 6/6) (PA) Polyether Block Amide (PEBA) Polyetherimide (PEI) Polystyrene (PS) Polyurethane (PU) Silicone (SIL) Styrene-Acrylonitrile (SAN) N/A Acrylonitrile-Butadiene-Styrene (ABS) Nickel Titanium (NiTi) Polyamide (Nylon 6/6) (PA) Polyether Block Amide (PEBA) Polystyrene (PS) Polyurethane (PU) Silicone (SIL) Styrene-Acrylonitrile (SAN) N/A Acrylonitrile-Butadiene-Styrene (ABS) Nickel Titanium (NiTi) Polyether Block Amide (PEBA) Polystyrene (PS) Polysulfone (PSU) N/A Acrylonitrile-Butadiene-Styrene (ABS) Nickel Titanium (NiTi) Polycarbonate (PC) Polyether Block Amide (PEBA) Polyethylene Terephthalate (PET) Polystyrene (PS)
Recommended Substrates N/A Acrylonitrile Butadiene Styrene (ABS) Nickel Titanium (NiTi) Polystyrene (PS) Polysulfone (PSU) N/A Acrylonitrile Butadiene Styrene (ABS) Nickel Titanium (NiTi) Polystyrene (PS) N/A Acrylonitrile Butadiene Styrene (ABS) Nickel Titanium (NiTi) Polystyrene (PS) N/A Acrylonitrile Butadiene Styrene (ABS) Nickel Titanium (NiTi) Polystyrene (PS) Polysulfone (PSU) N/A Acrylonitrile Butadiene Styrene (ABS) Polycarbonate (PC) Polyethylene Terephthalate (PET) Polystyrene (PS)
Recommended Curing Equipment N/A
Limited Applications N/A N/A Polysulfone (PSU) N/A Polyetherimide (PEI) Polysulfone (PSU) N/A Polyamide (Nylon 6/6) (PA) Polyetherimide (PEI) Polyurethane (PU) Styrene-Acrylonitrile (SAN) N/A Polyamide (Nylon 6/6) (PA) Polyether Block Amide (PEBA) Polyimide (PI) Polyurethane (PU) Polyvinyl Chloride (PVC)
Applications N/A
Features N/A
Additional Information N/A Dymax® MD® Adhesives, specially formulated for disposable medical device assembly, are used in a wide range of applications including catheter, syringe, anesthesia mask, reservoir, tube set, and medical electronics assembly. They help optimize assembly speeds to enable faster processing, greater output, and lower processing costs while allowing for 100% in-line inspection of bond lines. All of our adhesives are no solvents added and meet both USP Class VI and ISO 10993 biocompatibility standards.

MD® adhesives are intended for use in short-term (<29 days) or single-use disposable-device applications only. Dymax® does not authorize their use in long-term implant applications. In all cases, it's the user's responsibility to determine and validate the suitability of these adhesives in the intended medical device.

Compatible sterilization methods include gamma irradiation and ethylene oxide. Sterilization by autoclaving may be limited to certain applications. It remains the user's obligation to ascertain the effect of sterilization on the cured adhesive.
  • Cure in seconds with UV/Visible/LED light
  • No solvents added
  • One-part formulations and no mixing
  • ISO 10993 and other biocompatible approvals
  • Formulations with See-Cure, Ultra-Red®, or Encompass® technologies
  • Secondary heat-cure capability for shadow areas
  • Bond a broad range of substrates including Nylon 12 and PEBA
Note N/A Individual Product Data Sheets (PDS) list complete test data, with copies of test reports available upon request.
  • 1 U.S. Patents 6,080,450 & 7,892,386.