COMPANY HEADER
Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
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Unit of Measure
Items
Electronic Encapsulants

45 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant
Electronic Encapsulants

17.5 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant
Electronic Encapsulants

18.4 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant
Electronic Encapsulants

17.6 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant
Electronic Encapsulants

4,500 Centipoise (cP) Nominal Viscosity Electronic Encapsulant
Description N/A Electronic encapsulants provide complete protection of printed circuit board components and circuitry. The formulations cure tack-free in seconds upon exposure to UV/Visible/LED light. Some products feature secondary heat-cure or ambient moisture-cure capability for shadow areas on PCBAs. They fixture to rigid and flexible PCB platforms used in bare die, wire bond, chip-on-board, and IC applications.

  • UV/Visible/LED Light Cure
  • Electrically insulating
  • Low stress under thermal cycling
  • Secondary heat or moisture-cure formulations available
  • Minimize handling and increase throughput with fast curing
  • Simple dispense eliminates costs of complex dispensing system maintenance
Brands N/A Dymax®
Solvent Content N/A
Chemical Class N/A
Uncured Appearance N/A
Soluble in N/A
Density N/A
Test Method for Density N/A
Nominal Viscosity N/A 4,500 cP N/A 7,000 cP N/A 17,000 cP N/A 25,000 cP N/A 4,500 cP
Test Method for Nominal Viscosity at 20 Revolutions Per Minute (rpm) Speed N/A
Shelf Life at Room Temperature (RT) (22 to 25 Degree Celsius (ºC)) Temperature from Date of Manufacture N/A
Durometer Hardness N/A A85 N/A D30-D50 N/A D30-D50 N/A D30-D50 N/A D45
Test Method for Durometer Hardness N/A
Tensile at Break N/A
Test Method for Tensile at Break N/A
Elongation at Break N/A 300 % N/A 38 % N/A 34 % N/A 36 % N/A
Test Method for Elongation at Break N/A
Modulus of Elasticity N/A 45 MPa6,500 psi N/A 17.5 MPa2,550 psi N/A 18.4 MPa2,670 psi N/A 17.6 MPa2,560 psi N/A
Test Method for Modulus of Elasticity N/A
Glass Transition Temperature (Tg) N/A
Test Method for Glass Transition Temperature (Tg) N/A
Coefficient of Thermal Expansion (CTEα1) N/A
Test Method for Coefficient of Thermal Expansion (CTEα1) N/A
Coefficient of Thermal Expansion (CTEα2) N/A
Test Method for Coefficient of Thermal Expansion (CTEα2) N/A
Refractive Index at 20 Degree Celsius (ºC) Temperature N/A
Test Method for Refractive Index at 20 Degree Celsius (ºC) Temperature N/A
Boiling Water Absorption (2 Hours (h)) N/A
Test Method for Boiling Water Absorption (2 Hours (h)) N/A
Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h)) N/A
Test Method for Water Absorption (25 Degree Celsius (ºC) Temperature, 24 Hours (h)) N/A
Linear Shrinkage N/A
Test Method for Linear Shrinkage N/A
Dielectric Constant at 1 Megahertz (MHz) Frequency N/A
Test Method for Dielectric Constant at 1 Megahertz (MHz) Frequency N/A
Dissipation Factor at 1 Megahertz (MHz) Frequency N/A
Test Method for Dissipation Factor at 1 Megahertz (MHz) Frequency N/A
Dielectric Breakdown Voltage N/A
Test Method for Dielectric Breakdown Voltage N/A
Volume Resistivity N/A
Test Method for Volume Resistivity N/A
Surface Resistivity N/A
Test Method for Surface Resistivity N/A
Recommended Dispense Equipment N/A
Recommended Curing Equipment N/A
Recommended Substrates N/A N/A N/A N/A N/A Acrylonitrile Butadiene Styrene (ABS) Flame Retardant (FR-4) Metal Polycarbonate (PC) Polyvinyl chloride (PVC)
Recommended Adhesives N/A
Halogen Free? N/A Yes
Cured Linear Shrinkage N/A
Cured Durometer Hardness N/A
Ultraviolet (UV) Cure Speed N/A N/A N/A N/A N/A 15 seconds
Ultraviolet (UV) Cure Depth N/A N/A N/A N/A N/A 6.4 mm0.25 in
Note for Ultraviolet (UV) Cure Speed and Depth N/A N/A N/A N/A N/A UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.
Applications N/A
  • Chip-on-flex
  • Flex circuit bonding and attachment to PCB and glass
 		N/A
  • Chip-on-board
  • Chip-on-flex
  • Chip-on-glass
  • Wire bonding
 		N/A
  • Chip-on-board
  • Chip-on-flex
  • Chip-on-glass
  • Wire bonding
 		N/A
  • Chip-on-board
  • Chip-on-flex
  • Chip-on-glass
  • Wire bonding
 		N/A Potting Sealing
Features N/A
Additional Key Features N/A
  • 100% no solvents added
  • Low stress under thermal cycling
  • Instant UV/Visible cures
  • Electrically insulating
  • High ionic purity
  • Room-temperature storage
  • Tenacious adhesion to flex circuit substrates (polyimide and PET)
  • Thermal shock and moisture resistance
 		N/A
  • 100% no solvents added
  • Low stress under thermal cycling
  • Instant UV/Visible cures
  • Electrically insulating
  • High ionic purity
  • Room-temperature storage
  • Tenacious adhesion to flex circuit substrates (polyimide and PET)
  • Thermal shock and moisture resistance
 		N/A
  • 100% no solvents added
  • Low stress under thermal cycling
  • Instant UV/Visible cures
  • Electrically insulating
  • High ionic purity
  • Room-temperature storage
  • Tenacious adhesion to flex circuit substrates (polyimide and PET)
  • Thermal shock and moisture resistance
 		N/A
  • 100% no solvents added
  • Low stress under thermal cycling
  • Instant UV/Visible cures
  • Electrically insulating
  • High ionic purity
  • Room-temperature storage
  • Tenacious adhesion to flex circuit substrates (polyimide and PET)
  • Thermal shock and moisture resistance
 		N/A
  • Full UV/Visible cure in seconds
  • No solvent added
  • High adhesion to substrates
  • Flexible and rigid products available
Additional Information N/A